9.1 Bond Pad Rules¶
This section covers the design rules related to wire-bond and gold bump cases and for solder bump please refer to section 8.0
RULE NO. |
RULE NO. DESCRIPTION |
Wedge type Wire bond (without CUP) |
Ball type Wire bond (with CUP) |
Gold bump |
LAYER |
Pad |
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PAD.4 |
Top layer metal overlap of pad opening |
2 |