7.16 3.0um Thick MetalTop Option¶
This section describes the design rules for 3um thick Aluminum MetalTop design rules.
RULE NO.  | 
DESCRIPTION  | 
LAYOUT RULE  | 
Layer  | 
MT30 = 3um Metal Top  | 
|
MT30.1  | 
  | 
1.8 2.2  | 
MT30.2  | 
Min. thick MetalTop space  | 
1.8  | 
MT30.3  | 
The separation of two corners should satisfy the minimum spacing  | 
1.8  | 
MT30.4  | 
The separation of single metal line from a any degree metal line should satisfy the minimum spacing  | 
1.8  | 
MT30.5  | 
Minimum thick MetalTop enclose underlying via (for example: via5 for 6LM case) [Outside Not Allowed]  | 
0.12  | 
MT30.6  | 
Thick MetalTop end-of-line (width <2.5um) enclose underlying via (for example: via5 for 6LM case) [Outside Not Allowed]  | 
0.25  | 
MT30.7  | 
Thick MetalTop coverage over the entire die shall be >30% (Refer to section 13.0 for Dummy Metal-fill guidelines. Customer needs to Ensure enough dummy metal to satisfy Metaln coverage)  | 
|
MT30.8a  | 
As via size compare to min thick-metal width is very small. Single top via (e.g Via3 for 4 layer metal process with 3.0um thick top metal option. in other words via connecting to thick metal) At one location cannot exit under the thick (3um thick) metal.  | 
DRC check  | 
MT30.8b  | 
There shall be minimum 2X2 array of vias (top vias) at one location connecting to 3um thick top metal. Note: This rule will not checked for seal ring area (identified by GUARD_RING_MK As the via rules in this area are separately covered under seal ring section)  | 
DRC check  |